|Place of Origin:||CHINA|
|Model Number:||Non Toxic Refrigerant - 9|
|Minimum Order Quantity:||15KG|
|Packaging Details:||Disposable cylinder 25 lb / 11.3 kg;Recycling cylinder 400 l, 926 l;ISO - tanks.|
|Delivery Time:||Within 7 days|
|Payment Terms:||T/T, Western Union|
|Purity:||99%||Package:||As Your Requirement|
commonly used refrigerants,
air conditioner refrigerant
Carbon tetrafluoride CAS 75-73-0 R14 CF4 Non Toxic Refrigerant
Carbon tetrafluoride, also known as tetrafluoromethane, freon-14 and R 14, is a halogenated hydrocarbon (chemical formula: CF4).It can be regarded as either a halogenated hydrocarbon, halogenated methane, perfluorocarbon, or an inorganic compound.At minus 198 °C, the tetrafluoride has a monocline structure with lattice constants a = 8.597, b= 4.433, C = 8.381 (.10-1 nm), and beta = 118.73°.
Stable under normal temperature and pressure, avoid strong oxidant, inflammable or combustible.Do not fuel gas, high heat after the container pressure increases, there is a risk of cracking, explosion.Chemically stable, non-flammable.At room temperature, only liquid ammonia - sodium metal reagent can act.
|Melting point||−184 °C(lit.)|
|Boiling point||−130 °C(lit.)|
|Density||(solid, -195°) 1.98; d (liq, -183°) 1.89|
|Vapor density||3.04 (vs air)|
|Water Solubility||mL/100mL in H2O: 0.595 (10°C), 0.490 (20°C), 0.366 (40°C) [LAN05]|
Stable. Incompatible with zinc, alkaline earth metals, Group I metals,
aluminium and its alloys. Non-flammable.
|CAS DataBase Reference||75-73-0(CAS DataBase Reference)|
|NIST Chemistry Reference||Carbon tetrafluoride(75-73-0)|
|EPA Substance Registry System||Methane, tetrafluoro-(75-73-0)|
1. Used in plasma etching process of various integrated circuits, also used as laser gas, used as cryogenic refrigerant, solvent, lubricant, insulating material, and coolant of infrared detector tube.
2. The dosage in the microelectronics industry is the largest plasma etching gas, methane four fluorine high purity gas and four fluorine high purity, high purity oxygen mixture gas, methane can be widely used in silicon, silica, silicon, phosphorus silicon nitride thin film material such as glass and tungsten etching, in electronic components surface cleaning, the solar cell production, laser technology, cryogenic refrigeration, leak test, printed circuit also heavily used in the production of detergent, etc.
3. Plasma dry etching technology used as cryogenic refrigerant and integrated circuit.
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